This specification covers two-component, epoxy-resin bonding systems for application to Portland-cement concrete, which are able to cure under humid conditions and bond to damp surfaces.
Let see what does standard ASTM C 881 and 881M says:
The epoxy-resin bonding systems are classified according to type, grade, class, and color. The bonding systems can be classified as Type I, Type II, Type III, Type IV, Type V, Type VI, and Type VII according to their physical requirements. The epoxy resin constituent of Component A shall have an epoxy equivalent of 155 to 275.
According to their flow characteristics and viscosity, the bonding systems can be classified as Grade 1, Grade 2, and Grade 3. Also, in accordance with the range of temperatures for which they are suitable, these materials can be designated as Class A, Class B, Class C, Class D, Class E, and Class F. Classes A, B, and C are defined for Types I through V, and Classes D, E, and F are defined for Types VI and VII.
Epoxy resin systems are normally un-pigmented, but they can be colored or darkened. These bonding systems shall be furnished in two components for combining immediately prior to use in accordance with written instructions formulated Component A shall contain an epoxy resin with or without a reactive diluent. Component B shall contain one or more curing agents, which on mixing with Component A shall cause the mixture to harden. A suitable inert filler may be uniformly incorporated in one or both components. The filler shall be either non-settling or readily dispersible in any component in which it is incorporated. All systems shall cure under humid conditions, and bond to damp surfaces.
Different test methods shall be performed to determine the following properties:
> viscosity
> consistency,
> gel time,
> filler content, epoxy equivalent,
> viscosity,
> absorption,
> bond strength,
> thermal compatibility,
> heat deflection temperature,
> linear coefficient of shrinkage,
> compressive yield strength and modulus,
> tensile strength
> elongation at break,
> contact strength.
